The program undertaken was designed to determine the applicability of dielectric heating to the drying of ceramic components fabricated by wet processing techniques. The general characteristics of dielectric drying were studied along with the specific moisture removal characteristics for a typical wet-processed ceramic composition (50% clay, 25% flint, 25% feldspar). The results obtained in this investigation showed that rapid drying rates for ceramics are possible with the dielectric heating method. Wet ceramic components can be heated and dried uniformly in the electric field without the development of severe temperature and moisture gradients which might lead to cracking and/or warping of the components. Although drying rates were found to be extremely high, they are limited by the rupture strength of the material, i. e., its ability to withstand the stresses developed by the pressure of the escaping water vapor. Dielectric drying holds interesting possibilities for drying high-cost ceramic components or component systems which are difficult to process by other techniques.