Thin films of nickel-chromium were deposited on planar glass substrates by vacuum evaporation and sputtering processes. The alloy 'Nichrome V' with a bulk composition Ni 80% Cr 20% was evaporated from a tungsten filament and used as the cathode in the sputtering process. The composition ratio, sheet resistivity, thickness, film density and temperature coefficient of resistance were investigated or derived for each process and compared. Under constant deposition conditions the vacuum evaporated films indicate a variation of composition ratio with sheet resistivity whereas for sputtered films the ratio tends to remain nearly constant over an extended range of sheet resistivities. The temperature coefficient of resistance varies with the sheet resistivity from positive to negative for the evaporated films whereas for the sputtered films the coefficient remains positive over an extended range of sheet resistivities.