The objective was to detail the technology relevant to high volume production of thick-film hybrid electronics made with insulated-metal substrates. The technology applicable to ordnance projectile-fuze electronics was emphasized. The program was divided into several tasks to explore the critical elements of thick-film hybrid manufacturing. First, all physical, thermal, electrical, and chemical properties of commercially available porcelain-enameled steel (PES) substrates which affect their thick-film performance were measured and analyzed. Next, the properties of numerous thick- film conductors, dielectrics, and resistors were complied. Solderability and wire bondability of numerous conductors were evaluated. Properties of three vendors' resistor inks covering the full resistance range wee characterized. Effects of firing temperature variation on thick-film properties were analyzed. A small pilot production line was implemented using materials and processes established in the above tasks. Two batched totalling 150 units of a moderately complex hybrid fuze amplifier completed thick film fabrication with approximately 75 percent yield. Ten complete amplifiers were delivered to HDL for test. The feasibility of building ordnance hybrids on PES substrates in large volume is discussed. Factors limiting the feasibility are identified. Areas where material development is necessary are indicated.