The Handbook is a compilation of data and other relevant information obtained in the course of an 18-month program, details of which were presented in the final report published in August, 1983. The various known constructions of insulated metal (IM) substrates are described. The properties of porcelain- enameled steel (PES) substrates relevant to high-volume manufacture of thick- film hybrid microelectronic assemblies are presented. Typical properties of thick film conductors and resistors fired on PES substrates are described. Comparisons with alumina substrate materials are made. Wire bondability, solder back leach resistance, dependence of resistor properties on resistor geometry, and resistor stability data are presented. Thick-film and hybrid assembly experience with PES substrates are discussed. A bibliography citing numerous articles on PES, plasma-sprayed ceramic on metal, polymer thick film materials, and organic-metal laminates is included.