The goal of this program is to investigate new dielectrics, metals and processes for the fabrication of multi-chip modules which hold the promise of exceptional electrical performance in the GHz region in addition to high yield and high reliability. The low dielectric constant insulators are being evaluated through the fabrication of in-situ test structures using gold as the metallization. In the course of doing this evaluation, a simple process for gold MCMs has been investigated. A processing scheme using gold as the interconnection metallization in the module has been developed and is being characterized. The gold process has fewer process steps than the equivalent copper process and is potentially lower cost, particularly when high reliability is important. A unique adhesion material is under investigation and is currently being evaluated by n-Chip. The adhesion material would result in a significant cost reduction in the manufacture of copper or gold MCMs. Future plans are included in section 2.