This report briefly reviews the present understanding of adhesion fundamentals and methods of adhesion testing for thick- and thin-film conductors. It does this with a view to the need for military electronic circuitry with built-in reliability. The study concentrates on gold thick-film conductors and destructive and nondestructive adhesion test methods for thick- film conductors. It addresses the effects of substrate character, ink formulation, and circuit manufacturing processes upon film microstructures and, hence, properties of commercial and model thick-film materials. Twenty commercial gold conductors are under initial investigation; preliminary analyses of ten of these inks are presented. Alumina of 96 and 99.5 wt pct purities will be used as substrates in the study of commercial and model inks. Gold metal powders described in this report will be used in the formulation and testing of the model conductor inks. Plans for continuation of the above study and for additional work are outlined.