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Full text of "USPTO Patents Application 10020506"

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47490/RAG/S968 



WHAT IS CLAIMED IS: 

1 . A prepreg, comprising a substrate impregnated with a thermally conductive resin. 

2. The prepreg of claim 1, wherein the/substrate material includes carbon. 

3. The prepreg of claim 2, wherein tha substrate contains woven carbon fibers. 

4. The prepreg of claim 2, whereirrthe substrate^ncludes .unidirectional carbon fibers. 

5. The prepreg of claim 1, wherein tpe substrate includes fiberglass. 

6. The prepreg of claim 1 5 wherein/the substrate includes kevlar. 

7. The prepreg of claim 1, wheredi the substrate includes aramid. 

8. The prepreg of claim 1, wherein the substrate includes quartz. 



9. The prepreg of claim 1, vfherein the thermally conductive resin contains a boron nitride 
additive. 

10. The prepreg of claim 1, wherein the thermally conductive resin contains a diamond powder 
additive. 

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47490/RAG/S968 



11. The prepreg of claim 1, wherein /he thermally conductive resin contains an aluminum oxide 
additive. 

12. The prepreg of claim 1, where/n the thermally conductive resin has a thermal conductivity in 
excess of 1.25 W/m.K. 

13. The prepreg of claim 12, wherein the thermally conductive resin has a thermal conductivity 
in excess of 2.5 W/m.K. 

14. The prepreg of claim/ 1, wherein the thermally conductive resin is also electrically 
conductive. 



15. The prepreg of clair 
MHz. 



pin the prepreg has a dielectric constant greater than 6.0 at 1 



16. The prepreg of claim /14, wherein the electrically and thermally conductive resin contains a 
pyrolitic carbon additive. 



17. The prepreg of claim 14, wherein the electrically and thermally conductive resin contains a 
silver oxide additive. 



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47490/RAG/S968 

18. The prepreg of claim 14, wherein the electrically and thermally conductive resin contains 
carbon powder as an additive. 

19. The prepreg of claim 14/ wherein the electrically and thermally conductive resin has a 
5 dielectric constant greater thanp.O at 1 MHz. 



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20. A laminate, comprising: 

a prepreg, comprising a slTBsrfate impregnated \vith-a-thermally conductive resin; 
a first layer of electrically conductive material positioned above the prepreg; and 
a second layer of electricallyjconductive material positioned below the prepreg. 

21. The laminate of claim^Q, wherein the'thermally conductive resin has a thermal conductivity 
in excess of 1.25 W/r 




15 22. The laminate of claim/21, wherein the thermally conductive resin has a thermal conductivity 
in excess of 2.5 W/m.K. 



20 



23. The laminate of cpim 20, wherein the thermally conductive resin is also electrically 
conductive. 

24. The laminate of Jlaim 23, wherein the electrically and thermally conductive resin has a 
dielectric constant greater than 6.0 at 1 MHz. 

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47490/RAG/S968 



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25. A laminate, comprising: 
a subsrcate; 

a first prepreg layer positioned above the substrate; 
a second prapreg layer positioned below the substrate; 

a first layer of\lectrically conductive material positioned above the first prepreg layer; and 

a second layer of\lectrically conductive material positioned below the second prepreg layer; and 

wherein the dielectric constant of the laminate is greater than 6.0 at 1 MHz. 

26. The laminate of claim 25, wherein the prepregs contain electrically and thermally conductive 



10 resin. 



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27. The laminate of claim 26, wtt^rein the prepreg has a dielectric constant greater than 6.0 at 1 
MHz. 



15 28. The laminate of claim 26, whe/ein\he electrically and thermally conductive resin has a 
dielectric constant greater than 6.0 at 1 MHz 



20 



29. A printed wiring board, comprising: 
an electrically and thermally conductive laminate; 
a first dielectric layer positioned above the electricall^and thermally conductive laminate; and 
a second dielectric layer positioned below the electrically and thermally conductive laminate. 



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47490/RAG/S968 

30. The printed wiring board of claim 29, wherein: 

the electrically and thermally conductive laminate has a dielectric constant greater than 6.0 at 1 
MHz; and 

the first and secoAd prepreg layers have dielectric constants less than 6.0 at 1 MHz. 
5 \ 

3 1 . The printed wiring board of claim 29, wherein: 

the electrical^ and thermally conductive laminate is configured to carry an electrical load 
Jf sufficient for the lamin\te to act as a ground plane in the printed wiring board. 

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jijj 10 32. The printed wirin^board of claim 29, wherein: 
O \ 

fll the electrically and\tJ^emT^lly conductive laminate is configured to carry an electrical load 

s 

H 5 sufficient for the laminateftdPjact as a cower plane in the printed wiring board. 



rf 33. The printed wiring board of claim 29, wherein: 

\ 

15 the electrically and thermally conductive laminate is partitioned such that a first portion of 

the electrically and thermally conductive laminate is configured to carry an electrical load sufficient 



20 




for the first portion to act as a power plane in the printed wiring board and a second portion of the 
electrically and thermally conductiv^laminate is configured to carry an electrical load sufficient for 
the second portion to act as a ground plane in the printed wiring board. 

34. The printed wiring board of claim 29\ wherein: 

the electrically and thermally conductive laminate comprises: 

a prepreg, comprising a substrate impregnated with an electrically or thermally conductive resin; 

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47490/RAG/S968 



a first layer of electrically conductive material positioned above the prepreg; and 
a second layer of electridally conductive material positioned below the prepreg. 



35. The printed wiring Hoard of claim 29, wherein: 
the electrically and thermally conductive laminate comprises: 
a substrate; 

a first prepreg layer positioned above the substrate; 
a second prepreg layer positioned below the substrate; 

a first layer of electrically Conductive material positioned above the first prepregJayer; and 

a second layer of electrically conductive material positioned below the second prepreg layer; and 

wherein the dielectric constant of the laminate is greater than 6.0 at 1 MHz. 



36. The printed wiring board of claim 29, also comprising: 
at least one additional prepredlayer; 

at least one additional layer of Electrically conductive material; 
wherein the electrically and tjlfermall^conducting laminate, the additional prepreg layers and the 



additional layers of electrical 



y opjp&usivre material are positioned adjacent each other; 
wherein at least one prepregHa$pr is located between each of the additional layers of electrically 
conductive material; and 

wherein at least one prepreg layei\ is located between each of the additional layers of electrically 
conductive material and the electrically and thermally conducting laminate. 



37. The printed wiring board of claim 36, also comprising: 

at least one additional electrically and\thermally conducting laminate; 

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47490/RAG/S968 

wherein at least otoe prepreg layer is located between each of the additional layers of electrically 
conductive material Wd the additional electrically and thermally conductive laminates; and 
wherein at least one prepreg layer is located between each of the electrically and thermally 
conductive laminates.! 

38. The printed wiring board of claim 37, also comprising: 
at least one layer containing carbon; 

wherein at least one prepreg layer is located between each of the additional layers of electrically 
conductive material and tnz layers containing caf&on; and 

wherein at least one prepreg layer is located between the electrically and thermally conductive 
laminates and the layers containing carbon. 



39. The printed wiring board pf claim 29, wherein the printed wiring board includes a plurality of 
lined holes that extend from ^urflace of the printed wiring board through the electrically and 
thermally conductive laminate/ \ / \^ mmm00 ^ y ^ / 




40. The printed wiring board of claim 39, wherein the lining of the lined holes is a thermally 
conductive material. \ 

41. The printed wiring board of claim Vo, wherein the lining of the lined holes has a thermal 
conductivity greater than 1 .25 W/m.K. \ 

42. The printed wiring board of claim 41, wherein the lining of the lined holes has a thermal 
conductivity greater than 2.5 W/m.K. \ 






47490/RAG/S968 



43. The printed wiring ^oard of claim 39, wherein the lining of the lined holes is an electrically and 
thermally conductive material. 



44. The printed wiring board of claim 43, wherein the lining of the lined holes is copper. 



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m 10 



45. The printed wiring boam of claim 37, wherein: 

the electrically and thermally conductive laminate also comprises: 

a plurality of through holes I extending through said printed wiring board for providing electrical 

connection between at least two of said layers; 

an electrically conductive lining within the through holes; and 

at least one annulus of dielectmc material disposed at preselected locations between the electrically 
conductive lining and the electrically and thermally conductive laminate. 



15 



46. The printed wiring board 
dielectric constant less than 6j 



lclaim\5, where the annuli are constructed from material having a 



at 1/ 



47. The printed wiring boarrof claim 46, where the annuli are constructed from material having a 
dielectric constant less than 4.0 at l|MHz. 



20 48. The printed wiring board of claim 45, wherein the annuli prevent undesired electrical contact 
between the linings of the through holes and the electrically and thermally conductive laminates. 



49. A method of constructing a printed wiring board having circuits patterned onto its outer surfaces 

and circuits patterned on interior layer^ of conductive material, comprising the steps of: 

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47490/RAG/S968 

constructing a model o^the printed wiring board; 

determining portions o^the outer surface of the printed wiring board that do not contain 
patterned circuits; 

determining drilling locations within said determined portions that do not result in undesired 
electrical connections with the cfrcuits patterned on the interior layers of the printed wiring board; 

constructing the printed] wiring board such that said determined portions are plated with 
thermally conductive material; 

drilling holes in the con \ 

and 



lining said holes with the; 



tructed printed wiring board in said determined drilling locations; 



lally conductive material. 



50. A method of constructing a panted wiring board having an electrically and thermally conductive 



laminate, a plurality of layers of e 

and lined through holes that conn 

comprising the steps of: 

constructing a model ofj 
constructing said elect 
identifying the locations ir 

thermally conductive laminate; 

determining whether an e 



ectrically conductive material that have circuits patterned on them 
ct the circuits on the layers of electrically conductive material, 



the 



;all 



if an electrical connection 
in said electrically and thermally co 



jrinte^ board; 
and thermally conductive laminate; 

which the lined through holes intersect the electrically and 



(ctrical connection is desired between the lining of the lined 



through hole and the electrically anc thermally conductive laminate at each of said locations; 



not desired at said location, then drilling a hole at said location 
ductive laminate and filling said hole with a dielectric material. 



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47490/RAG/S968 

51 . A method of constnfcting a prepreg, comprising the steps of: 

impregnating a substrate with a thermally conductive resin. 

52. The method of claim 51, wherein the thermally conductive resin is also electrically conductive. 

53. A method of constructing a laminate, comprising the steps of: 

impregnating a suastrate with a thermally conductive resin to create a prepreg having a top 
surface and a bottom surface; and 

laminating a first later of electrically conductive materiaUo^he upp.er .surface of the prepreg 
and a second layer of electrically conductive material to the lower surface of the prepreg. 

54. The method of claim 53J^vher^n the thermally conductive resin is also electrically conductive. 

55. A method of constituted a printed wiring board, comprising the steps of: 

constructing an electrically and thermally conductive laminate having an upper surface and a 
lower surface; 1 

laminating a first prepieg layer to the upper surface of the laminate and a second prepreg 
layer to the lower surface of thd laminate. 




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