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Full text of "USPTO Patents Application 10020506"

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Appln No. 10/020,506 

Amdt date December 15, 2003 

R ply to Office action of Jtily 15, 2003 

Amendments to the Claims: 

This listing of claims will replace all prior versions, and 
listings, of claims in the application: 

Listing of Claims: 

1-55. (Cancelled) 

56. (Currently amended) A printed wiring board on which an 
oloctronic dcvico io mounted, comprising: 

at least one carbon containing layer; 

at least one electrically conductive layer that includes at 
least one circuit; 

at least one dielectric layer located between the carbon 
containing layer and the electrically conductive layer; and 

wherein at least one electrical connection exists between 
the carbon containing layer and the electronic dcvico circuit on 
the electrically conductive layer . 

57. (Previously presented) The printed wiring board of 
claim 56, wherein the carbon containing layer comprises a 
substrate containing carbon impregnated with a resin. 

58. (Previously presented) The printed wiring board of 
claim 57, wherein the substrate comprises woven carbon fibers. 

59. (Currently amended) The printed wiring board of claim 
57, wherein the carbon containing lavor substrate comprises 
unidirectional carbon fibers. 



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Appln No. 10/020,506 

Amdt date Deceinb r 15, 2003 

R ply to Office action of July 15, 2003 



60. (Previously presented) The printed wiring board of 
claim 57, wherein the resin is an electrically conductive resin. 

61. (Previously presented) The printed wiring board of 
claim 60, wherein the electrically conductive resin has a 
dielectric constant greater than 6.0 at 1 MHz . 

62. (Previously presented) The printed wiring board of 
claim 60, wherexn the eiectricaaly conductive" resin contain"s a 
pyrolytic carbon additive. 

63. (Previously presented) The printed wiring board of 
claim 60, wherein the electrically conductive resin contains a 
silver oxide additive. 

64. (Previously presented) The printed wiring board of 
claim 60, wherein the electrically conductive resin contains 
carbon powder as an additive. 

65. (Currently amended) The printed wiring board of claim 
•&7-60 , wherein: 

the carbon containing layer is clad on at least one side 
with aft second electrically conductive layer; and 

an electrical connection between the carbon containing layer 
and the second electrically conductive layer is established by 
contact between the electrically conductive resin impregnated 
into the carbon substrate in the carbon containing layer and the 
second electrically conductive layer. 

66. (Previously presented) The printed wiring board of 
claim 56, wherein the carbon containing layer comprises a carbon 
plate. 



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Appln No. 10/020,506 

Azndt date December 15, 2003 

Reply to Office action of July 15, 2003 

67. - 70. (Cancelled) 

71. (Currently amended) The printed wiring board of claim 
57, wherein: 

the carbon containing layer is clad on at least one side 
with aft second electrically conductive layer; and 

an electrical connection between the carbon containing layer 
and the second electrically conductive layer is established by 
contact between the carbon substrate in the carbon containing 
layer and the second electrically conductive layer. 

72. (New) The printed wiring board of claim 56, wherein the 
electrical connection includes a lined through hole. 

73. (New) The printed wiring board of claim 72, wherein the 
lining of the lined through hole contacts the carbon containing 
layer . 

74. (New) The printed wiring board of claim 72, wherein the 
lining of the lined through hole contacts the circuit on the 
electrically conductive layer. 

75. (New) A printed wiring board, comprising a layer 
containing carbon, wherein the layer containing carbon is a 
functional layer of the printed wiring board. 

76. (New) The printed wiring board of claim 75, wherein the 
layer containing carbon includes a carbon fiber substrate 
impregnated with a resin. 



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Appln No. 10/020,506 

Amdt date December 15, 2003 

Reply to Office action of July 15, 2003 

77. (New) The printed wiring board of claim 75, wherein the 
layer containing carbon is a ground plane. 

78. (New) The printed wiring board of claim 75, wherein the 
layer containing carbon is a power plane. 

79. (New) The printed wiring board of claim 75, wherein: 
the layer containing carbon is divided into at least two 

regions ; 

a first region of the layer containing carbon acts as a 
power plane; and 

a second region of the layer containing carbon acts as a 
ground plane. 

80. (New) A printed wiring board comprising a layer 
containing carbon, wherein a portion of the layer containing 
carbon acts as a power plane. 

81. (New) The printed wiring board of claim 80, wherein the 
layer containing carbon includes a carbon fiber substrate 
impregnated with a resin. 

82. (New) A printed wiring board comprising a layer 
containing carbon, wherein a portion of the layer containing 
carbon acts as a power plane. 

83. (New) The printed wiring board of claim 82, wherein the 
layer containing carbon includes a carbon fiber substrate 
impregnated with a resin. 



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Appln No. 10/020,506 

Axndt date December 15, 2003 

Reply to Offic action of July 15, 2003 

84. (New) The printed wiring board of claim 82, wherein a 
portion of the layer containing carbon also acts as a ground 
plane . 



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