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Full text of "USPTO Patents Application 10825796"

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I CLAIM: 

1. Physical shock hardened heat sink inclusive semiconductor device mounting 
apparatus comprising the combination of: 

a printed circuit board composed of electrical insulating material and supporting 
on at least a first surface thereof an array of metallic film electrical conductors; 

a T cross-sectioned heat sink metallic body member having a T stem body 
element of substantial width and length and extended depth dimensions received in 
transverse of an aperture opening of said printed circuit board; 

said T cross-sectioned heat sink metallic body member including T arm portions 
extending along and beyond said T stem body element substantial width dimension along a 
first surface of said printed circuit board; 

said T cross-sectioned heat sink metallic body member including first and second 
of said T arm portions disposed at opposed depth dimension ends of said T stem body 
element extended depth dimension and a heat sink metallic body member saddle region 
semiconductor device reception area located intermediate said first and second T arm 
portions on a depth dimension portion of said heat sink metallic body member; and 

said T cross-sectioned heat sink metallic body member including a T stem body 
element slot member and a T stem body element slot member-engaged keeper member 
disposed along a second surface of said printed circuit board to hold said printed circuit 
board in captured engagement between said T arm portions and said slot member-engaged 
keeper member. 

2. The physical shock hardened heat sink inclusive semiconductor device mounting 
apparatus of claim 1 wherein said metallic film electrical conductors and said T cross- 
sectioned heat sink metallic body member are comprised of metallic copper. 

3. The physical shock hardened heat sink inclusive semiconductor device mounting 
apparatus of claim 2 wherein said T cross-sectioned heat sink metallic body member T arm 
portions are connected by tin/lead solder with selected of said printed circuit board surface 
array of metallic film electrical conductors. 

4. The physical shock hardened heat sink inclusive semiconductor device mounting 
apparatus of claim 1 wherein said first and second of said T arm portions are of rectangular 
cross section. 



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5. The physical shock hardened heat sink inclusive semiconductor device mounting 
apparatus of claim 1 further including a semiconductor device received in intimate thermal 
contact with said heat sink metallic body member saddle region. 

6. The physical shock hardened heat sink inclusive semiconductor device mounting 
apparatus of claim 5 wherein said semiconductor device intimate thermal contact includes 
a solder interface connection with a saddle region portion of said heat sink. 

7. The physical shock hardened heat sink inclusive semiconductor device mounting 
apparatus of claim 5 wherein said semiconductor device intimate thermal contact includes 
a thermally conductive silicone material interface connection with said saddle region 
portion of said heat sink. 

8. The physical shock hardened heat sink inclusive semiconductor device mounting 
apparatus of claim 2 wherein said printed circuit board includes a second array of metallic 
film electrical conductors on a second surface thereof and wherein said T stem body element 
slot member-engaged keeper member includes a tin/lead solder interface connection with 
said second array of metallic film electrical conductors on said second printed circuit board 
surface. 

9. The physical shock hardened heat sink inclusive semiconductor device mounting 
apparatus of claim 1 further including a second T stem body element slot member and a 
second T stem body element slot member-engaged keeper member disposed along said 
second surface of said printed circuit board and additionally holding said printed circuit 
board in captured engagement between said T arm portions and said slot member-engaged 
keeper members. 

10. The physical shock hardened heat sink inclusive semiconductor device mounting 
apparatus of claim 1 wherein said heat sink metallic body member saddle region 
semiconductor device reception area is disposed in a coplanar flush relationship with said 
printed circuit board first surface. 

11. The high G-force physical impact tolerant, high thermal conductivity and low 
electrical inductance method of mounting and heat sinking a semiconductor device 
comprising the steps of: 

disposing said semiconductor device in a flowed thermal conductive media- 
maintained physical, thermal, and electrical contact with a heat sink element of conductive 
metal thermal conductivity characteristics; 



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said disposing step also locating said semiconductor device in at least 
unidirectional physical restraint intermediate integral structural portions of said metallic 
heat sink element; 

suspending said metallic heat sink element and said semiconductor device in 
captive confinement within an aperture of an electrically insulating printed circuit board; 

retaining said metallic heat sink element within said aperture of said electrically 
insulating printed circuit board using metallic heat sink-connected metallic wing elements 
spreading across opposed lateral surface portions .of said printed circuit board adjacent said 
aperture; and 

bonding selected portions of said metallic heat sink-connected metallic wing 
elements with adjacent electrically and thermally conductive electrically grounded film 
wiring conductor located on a surface of said printed circuit board. 

12. The high G-force physical impact tolerant, high thermal conductivity and low 
electrical inductance method of mounting and heat sinking a semiconductor device of claim 
11 wherein said disposing step and said bonding step each include a soldering with tin/lead 
solder step. 

13. Impact resistant semiconductor device mounting and cooling apparatus 
comprising the combination of: 

a printed circuit board having electrical conductors arrayed on first and second 
surfaces thereof and having a shaped transverse opening located in a selected portion 
thereof; 

an integral metallic heat sink member of first cross section shape conforming 
with said printed circuit board shaped transverse opening and disposed within in said 
transverse opening; 

said integral metallic heat sink member having a second cross sectional shape 
orthogonal of said first cross sectional shape and inclusive of a wing element portion 
extending along said printed circuit board first surface; and 

said integral metallic heat sink member having a third cross sectional shape 
orthogonal of both said first cross sectional shape and said second cross sectional shape and 
including a recessed saddle portion parallel with said printed circuit board along a first 
cross sectional extremity and a grooved recess parallel with and adjacent said printed 
circuit board second surface along a second cross sectional extremity. 



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14. The impact resistant semiconductor device mounting and cooling apparatus of 
claim 13 wherein said first cross sectional shape also includes said second cross sectional 
shape wing members. 

15. The impact resistant semiconductor device mounting and cooling apparatus of 
claim 13 wherein said integral metallic heat sink member third cross sectional shape 
recessed saddle portion and said printed circuit board first surface electrical conductors are 
disposed in substantially coplanar elevation. 

16. The impact resistant semiconductor device mounting and cooling apparatus of 
claim 13 further including a second grooved recess parallel with and adjacent said printed 
circuit board second surface and received in a third extremity of said third cross sectional 
shape. 

17. The impact resistant semiconductor device mounting and cooling apparatus of 
claim 16 further including a first and second metallic keeper members engaged with said 
first and second grooved recesses and capturing said printed circuit board intermediate said 
first cross sectional shape wing element portion and said first and second metallic keeper 
members. 

18. The impact resistant semiconductor device mounting and cooling apparatus of 
claim 17 wherein said first and second metallic keeper members and said first cross 
sectional shape wing element portion are engaged with said printed circuit board first and 
second surface electrical conductors by tin/lead solder. 

19. The impact resistant semiconductor device mounting and cooling apparatus of 
claim 13 wherein said integral metallic heat sink member also comprises an electrical 
current conducting portion of said printed circuit board first and second surface electrical 
conductors. 

20. The impact resistant semiconductor device mounting and cooling apparatus of 
claim 13 wherein said metallic heat sink member third cross sectional shape recessed 
saddle portion is disposed in a coplanar relationship with a topside surface of said printed 
circuit board and wherein a metal window portion of a heat sink-mounted semiconductor 
device is soldered to said saddle portion with circuit leads of said semiconductor device 
overhanging said saddle portion and engaging topside circuit conductors of said printed 
circuit board. 



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