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Full text of "USPTO Patents Application 10825796"

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Appl. No. 10/825,796 

Amdt. dated 16 Feb 05 

Reply to Office action of 10 Dec 04 



Amendments to the Claims 

This listing of claims will replace all prior versions, or listings, or claims in the 
application. 

Listing of Claims - 

1. (currently amended) Physical shock hardened heat sink inclusive semiconductor 
device mounting apparatuG comprising the combination of 

a physical shock resistant printed circuit board composed of electrical insulating 
material and including oupporting on at least a first surface thereof an array of metallic 
film electrical conductors; 

a metallic T crooo-ooctionod heat sink motallic body member having a T stem 
body portion olomont of oubotantial width and length and oxtondod depth dimonoiono 
received in extending in transverse relationship with ef an aperture opening of said printed 
circuit board; 

said metallic T crooo-ooctionod heat sink metallic body member including 
integral T arm portions located at a T stem extremity and extending along and beyond said 
T stem body portion in intimate proximity with first surface portions olomont oubotantial 
width dimonoion along a firot ourfaco of said printed circuit board; 

said metallic T crooo-ooctionod heat sink motallic body member also including 
first and oocond of oaid T arm portidno diopoood at oppoood dopth dimonoion ondo of Gaid T 
otom body olomont extended dopth dimonoion and a heat oink motallic body member oaddlo 
region a semiconductor device reception area saddle region located intermediate said first 
and second pairs of integral T arm portions on a dopth dimension portion of said metallic 
heat sink metallic body member; and 

said heat sink T stem body portion crooo-ooctionod hoat sink motallic body 
member including a T stem body portion clement slot member and a T otom body olomont 
olot member engaged keeper mombcr diopoood in alignment with along a second surface of 
said printed circuit board and enabling a keeper member retention of to hold said printed 
circuit board in captured engagement with a between Gaid T arm portion portiono during a 
physical shock event and oaid olot member engaged keeper member . 

2. (currently amended) The physical shock hardened heat sink inclusive 
semiconductor device mounting apparatus of claim 1 wherein said metallic film electrical 



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Appl.No. 10/825,796 
• Amdt. dated 16 Feb 05 

Reply to Office action of 10 Dec 04 

conductors and said T cross-sectioned heat sink metallic body member are comprised of 
metallic copper. 

3. (currently amended) The physical shock hardened heat sink inclusive 
semiconductor device mounting apparatus of claim 2 wherein said T cross-sectioned heat 
sink metallic body member T arm portions are connected by tin/lead solder with selected 
portions of said printed circuit board surface array of metallic film electrical conductors. 

4. (currently amended) The physical shock hardened heat sink inclusive 
semiconductor device mounting apparatus of claim 1 wherein said first and second of said T 
arm portions are of rectangular cross section. 

5. (currently amended) The physical shock hardened heat sink inclusive 
semiconductor device mounting apparatus of claim 1 further including a semiconductor 
device received in intimate thermal contact with said heat sink metallic body member 
saddle region. 

6. (currently amended) The physical shock hardened heat sink inclusive 
semiconductor device mounting apparatus of claim 5 wherein said semiconductor device 
intimate thermal contact includes a solder interface connection with a saddle region portion 
of said heat sink. 

7. (currently amended) The physical shock hardened heat sink inclusive 
semiconductor device mounting apparatus of claim 5 wherein said semiconductor device 
intimate thermal contact includes a thermally conductive silicone material interface 
connection with said saddle region portion of said heat sink. 

8. (currently amended) The physical shock hardened heat sink inclusive 
semiconductor device mounting apparatus of claim 2 wherein said printed circuit board 
includes a second array of metallic film electrical conductors on a second surface thereof 
and wherein said T stem body element olot mombor ongagod keeper member includes a 
tin/lead solder interface connection with said second array of metallic film electrical 
conductors on said second printed circuit board surface. 

9. (currently amended) The physical shock hardened heat sink inclusive 
semiconductor device mounting apparatus of claim 1 further including a second T stem 
body element slot member and a second T stem body element slot member-engaged keeper 
member disposed along a said second surface of said printed circuit board and additionally 
holding said printed circuit board in captured engagement between said T arm portions and 
a eaid slot member-engaged keeper member. 



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Appl. No. 10/825,796 
• Amdt. dated 16 Feb 05 

Reply to Office action of 10 Dec 04 

10. (currently amended) The physical shock hardened heat sink inclusive 
semiconductor device mounting apparatus of claim 1 wherein said heat sink metallic body 
member saddle region semiconductor device reception area is disposed in a coplanar flush 
relationship with said printed circuit board first surface. 

11. (currently amended) The high G-force physical impact tolerant, high thermal 
conductivity and low electrical inductance method of mounting and hoat oinking a 
semiconductor device and heat sink comprising the steps of 

disposing said semiconductor device in a flowed thermal conductivo mcdia- 
maintaincd solidified liquid interface inclusive intimate physical, thermal, and electrical 
contact with a metallic heat sink element of selected conductivo motal thermal and 
electrical conductivity characteristics; 

said disposing step also including locating said semiconductor device in high G- 
force physical impact tolerant at loaot unidirectional physical restraint intermediate 
integral structural portions of said metallic heat sink element; 

suspending said metallic heat sink element and said semiconductor device in 
captive confinement within an aperture of an electrically insulating high G-force physical 
impact tolerant printed circuit board; 

retaining said metallic heat sink element within said aperture of said electrically 
insulating high G-force physical impact tolerant printed circuit board using metallic heat 
sink-connected metallic wing elements spreading across lateral surface portions of said 
printed circuit board adjacent said aperture; and 

bonding selected portions of one of said metallic heat sink element and said 
metallic heat sink- connected metallic wing elements with adjacent electrically and 
thermally conductive electrically grounded film wiring conductors located on a surface of 
said printed circuit board. 

12. (currently amended) The high G-force physical impact tolerant, high thermal 
conductivity and low electrical inductance method of mounting and hoat sinking a 
semiconductor device and heat sink of claim 11 wherein said disposing step and said 
bonding step each include a soldering with tin/lead solder step. 

13. (currently amended) Impact resistant semiconductor device mounting and 
cooling apparatus comprising the combination of 



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Appl. No. 10/825,796 
• Amdt. dated 16 Feb 05 

Reply to Office action of 10 Dec 04 

a printed circuit board having electrical conductors arrayed on first and second 
surfaces thereof and having a shaped transverse opening located in a selected portion 
thereof; 

an integral metallic heat sink member of first cross section shape conforming 
with said printed circuit board shaped transverse opening and disposed within said 
transverse opening; 

said integral metallic heat sink member having a second cross sectional shape 
orthogonal to of said first cross sectional shape and inclusive of a wing element portion 
extending along said printed circuit board first surface; and 

said integral metallic heat sink member having a third cross sectional shape 
orthogonal to of both said first cross sectional shape and said second cross sectional shape 
and including a recessed saddle portion parallel with said printed circuit board along a first 
cross sectional extremity and a grooved recess parallel with and adjacent said printed 
circuit board second surface along a second cross sectional extremity. 

14. (original) The impact resistant semiconductor device mounting and cooling 
apparatus of claim 13 wherein said first cross sectional shape also includes said second 
cross sectional shape wing members. 

15. (original) The impact resistant semiconductor device mounting and cooling 
apparatus of claim 13 wherein said integral metallic heat sink member third cross sectional 
shape recessed saddle portion and said printed circuit board first surface electrical 
conductors are disposed in substantially coplanar elevation. 

16. (original) The impact resistant semiconductor device mounting and cooling 
apparatus of claim 13 further including a second grooved recess parallel with and adjacent 
said printed circuit board second surface and received in a third extremity of said third 
cross sectional shape. 

17. (original) The impact resistant semiconductor device mounting and cooling 
apparatus of claim 16 further including a first and second metallic keeper members 
engaged with said first and second grooved recesses and capturing said printed circuit 
board intermediate said first cross sectional shape wing element portion and said first and 
second metallic keeper members. 

18. (original) The impact resistant semiconductor device mounting and cooling 
apparatus of claim 17 wherein said first and second metallic keeper members and said first 



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Appl.No. 10/825,796 
• Amdt. dated 16 Feb 05 

Reply to Office action of 10 Dec 04 

cross sectional shape wing element portion are engaged with said printed circuit board first 
and second surface electrical conductors by tin/lead solder. 

19. (original) The impact resistant semiconductor device mounting and cooling 
apparatus of claim 13 wherein said integral metallic heat sink member also comprises an 
electrical current conducting portion of said printed circuit board first and second surface 
electrical conductors. 

20. (original) The impact resistant semiconductor device mounting and cooling 
apparatus of claim 13 wherein said metallic heat sink member third cross sectional shape 
recessed saddle portion is disposed in a coplanar relationship with a topside surface of said 
printed circuit board and wherein a metal window portion of a heat sink-mounted 
semiconductor device is soldered to said saddle portion with circuit leads of said 
semiconductor device overhanging said saddle portion and engaging topside circuit 
conductors of said printed circuit board. 

21. (new) The high G-force physical impact tolerant, high thermal conductivity and 
low electrical inductance method of mounting a semiconductor device and heat sink of claim 
12 wherein said step of bonding selected portions of one of said metallic heat sink element 
and said metallic heat sink-connected metallic wing elements with adjacent electrically and 
thermally conductive film wiring conductors located on a surface of said printed circuit 
board includes bonding selected portions of each of said metallic heat sink element and said 
metallic heat sink-connected metallic wing elements with adjacent electrically and 
thermally conductive film wiring conductors located on each surface of said printed circuit 
board. 

22. (new) The high G-force physical impact tolerant, high thermal conductivity and 
low electrical inductance method of mounting a semiconductor device and heat sink of claim 
21 wherein said bonded selected portions of each of said metallic heat sink element 
comprise heat sink-integral wing elements. 

23. (new) The high G-force physical impact tolerant, high thermal conductivity and 
low electrical inductance method of mounting a semiconductor device and heat sink of claim 
11 wherein one of said disposing step and said bonding step include application of a 
hardenable liquid organic material. 



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