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Docket No.: 4459-147 PATENT 
IN THE UNITED STATES PATENT AND TRADEMARK OFFICE 

In re Application of 
SuTAO 

U.S. Patent Application No. Not yet assigned 
Filed: Herewith 



Confirmation No. Not yet assigned 
Group Art Unit: Not yet assigned 
Examiner: Not yet assigned 



For: MICROMACHINE PACKAGE AND METHOD FOR MANUFACTURING THE 
SAME 

CLAIM OF PRIORITY AND 
TRANSMITTAL OF CERTIFIED PRIORITY DOCUMENT 



Commissioner for Patents 

P.O. Box 1450 

Alexandria, VA 22313-1450 

Dear Sir: 

In accordance with the provisions of 35 U.S.C. 119, Applicant hereby claims, in the 
present application, the priority of Taiwanese Patent Application No. 092120272, filed July 24, 
2003. The certified copy is submitted herewith. 

Respectfully submifted, 

LOWE hXupXmAN GILMAN & BERNER, LLP 



1700 Diagonal Road, Suite 310 
Alexandria, Virginia 223 14 
(703) 684-1111 BJH/etp 
Facsimile: (703)518-5499 
Date: April 19, 2004 




Hauptman 
No. 29,310 




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INTELLECTUAL PROPERTY OFFICE 
MINISTRY OF ECONOMIC AFFAIRS 
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This is to certify that annexed is a true v copy from the records of this . j 
office of the application as original ly fi led which is identified hereunder : 

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Application Da^te 



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Application No. 



092120272 



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Director General 







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Issue Date — ^ 

: 09220935190 




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1HE SAME) 

A micro-machine package comprises a first 
chip, a second chip, a spacer loop, a plurality of 
bumps, a plurality of leads, and an encapsulant. 
The first chip had at least one moveable 
structure. The second chip has at least one 
electrode for cooperating with the moveable 
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spacer loop is disposed between the first chip and 
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The lead has a first surface, which is connected 
to the bump, and a opposite second surface. The 
encapsulant encapsulates the first chip, the 
second chip, the spacer loop, the bumps, and the 
first surfaces of the leads, and the second 




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surfaces of the leads are exposed out of the 
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