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Full text of "USPTO Patents Application 10826261"

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MICROMACHINE PACKAGE AND METHOD FOR 
MANUFACTURING THE SAME 

ABSTRACT 

A micromachine package comprises a first chip, a second chip, a spacer ring, a 
plurality of bumps, a plurality of leads, and an encapsulant. The first chip has at least 
one moveable structure. The second chip has at least one electrode for cooperating with 
the moveable structure of the first chip, and a plurality of pads disposed on one side of 
the second chip. The spacer ring is disposed between the first chip and the opposite 
second chip and surrounds the moveable structure. The bumps are disposed on the pads. 
The lead has a first surface, which is connected to the bumps, and an opposite second 
surface. The encapsulant encapsulates the first chip, the second chip, the spacer ring, 
the bumps, and the first surfaces of the leads, and the second surfaces of the leads are 
exposed out of the encapsulant. 


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