Skip to main content

Full text of "USPTO Patents Application 10826261"

See other formats


What is claimed is: 

1. A micromachine package comprising: 
a first chip, 

a second chip having a plurality of pads disposed on one side of the second chip; 
at least one moveable structure disposed on one of the first chip and the second 

chip; 

at least one electrode for cooperating with the moveable stmcture and disposed 
on one of the first chip and the second chip, 

a spacer ring disposed between the first chip and the second chip and 
surrounding the moveable structure; 

a plurality of bumps disposed on the pads; 

a plurality of leads each defining a first lead surface connected to the bump, and 
an opposite second lead surface; and 

an encapsulant encapsulating the first chip, the second chip, the spacer ring, the 
bumps, and the first lead surfaces of the leads, wherein the second lead surfaces of the 
leads are exposed out of the encapsulant. 

2. The micromachine package as claimed in claim 1, fiirther comprising: 

a die pad defining a first die-pad surface and an opposite second die-pad surface, 
wherein the first die-pad surface is connected to the first chip and the second die-pad 
surface is exposed out of the encapsulant. 

3. The micromachine package as claimed in claim 2, fiirther comprising: 
an adhesive for attaching the first chip to the die pad. 

4. The micromachine package as claimed in claim 1, wherein the second lead 
surfaces of the leads are fiush with the encapsulant. 

5. The micromachine package as claimed in claim 1, further comprising a 
plurality of solder balls for electrically connecting the first chip to the second chip. 

6. The micromachine package as claimed in claim 1, wherein the bump is a gold 

bump. 



7. The micromachine package as claimed in claim 1, wherein the bump is a 
solder bump, 

8. A micromachine package comprising: 
a lid; 

a chip having at least on moveable structure and a plurality of pads disposed on 
one side of the chip; 

a spacer ring disposed between the lid and the chip and surrounding the 
moveable structure; 

a plurality of bumps disposed on the pads; 

a plurality of leads each defining a first lead surface connected to the bump, and 
an opposite second lead surface; and 

an encapsulant encapsulating the lid, the chip, the spacer ring, the bumps, and 
the first lead surfaces of the leads, wherein the second lead surfaces of the leads are 
exposed out of the encapsulant. 

9. The micromachine package as claimed in claim 8, further comprising: 

a die pad defining a first die-pad surface and an opposite second die-pad surface, 
wherein the first die-pad surface is connected to the lid and the second die-pad surface 
is exposed out of the encapsulant. 

10. The micromachine package as claimed in claim 9, further comprising: 
an adhesive for attaching the lid to the die pad. 

11. The micromachine package as claimed in claim 8, wherein the second lead 
surfaces of the leads are flush with the encapsulant. 

12. The micromachine package as claimed in claim 8, wherein the bump is a 
gold bump. 

13. The micromachine package as claimed in claim 8, wherein the bump is a 
solder bump. 

14. A micromachine package comprising: 

a lid having a plurality of pads disposed on one side of the lid; 



10 



a chip having at least on moveable structure; 

a plurality of solder balls for electrically connecting the chip to the lid; 

a spacer ring disposed between the lid and the chip and surrounding the 
moveable structure; 

a plurality of bumps disposed on the pads; 

a plurality of leads each defining a first lead surface connected to the bump, and 
an opposite second lead surface; and 

an encapsulant encapsulating the lid, the chip, the spacer ring, the bumps, and 
the first lead surfaces of the leads, wherein the second lead surfaces of the leads are 
exposed out of the encapsulant. 

15. The micromachine package as claimed in claim 14, further comprising: 

a die pad defining a first die-pad surface and an opposite second die-pad surface, 
wherein the first die-pad surface is connected to the chip and the second die-pad surface 
is exposed out of the encapsulant. 

16. The micromachine package as claimed in claim 15, fiirther comprising: 
an adhesive for attaching the chip to the die pad. 

17. The micromachine package as claimed in claim 14, wherein the second lead 
surfaces of the leads are flush with the encapsulant. 

18. The micromachine package as claimed in claim 14, wherein the bump is a 
gold bump. 

19. The micromachine package as claimed in claim 14, wherein the bump is a 
solder bump. 

20. A method for manufacturing a plurality of micromachine packages, 
comprising the following steps of: 

providing a first wafer which comprises a plurality of first chips each having at 
least one moveable structure and a plurality of pads disposed on one side of the first 
chip, and a plurality of scribe lines disposed between the chips; 

forming a plurality of spacer rings individually on the first chips of the first 
wafer for surrounding the moveable structures; 



11 



providing a lid substrate which comprises a plurality of lids, and a plurality of 
scribe lines disposed between the lids; 

attaching the lid substrate on the spacer rings for forming a cavity between the 
first chip and the lid 2ind receiving the moveable structure; 

cutting the wafer and the lid along the scribe lines of the wafer and the scribe 
lines of the lid substrate for forming a plurality of combined chips; 

forming a plurality of bumps on the pads; 

providing a lead frame stripe which is provided with a plurality of lead frames 
each having a plurality of leads defining first lead surfaces and opposite second lead 
surfaces; 

disposing the combined chips on the lead frames and connecting the bumps to 
the first lead surfaces of the leads; and 

molding a plurality of encapsulants each encapsulating the first chip, the lid, the 
spacer ring, the bumps, and the first lead surfaces of the leads, wherein the second lead 
surfaces of the leads are exposed out of the encapsulants. 

21. The method as claimed in claim 20, wherein the lead frame is fiirther 
provided with a die pad defining a first die-pad surface and an opposite second die-pad 
surface, the first die-pad surface is connected to the lid and the second die-pad surface is 
exposed out of the encapsulant. 

22. The method as claimed in claim 21, further comprising the steps of: 
applying an adhesive on the die pad; and 

attaching the lid to the die pad. 

23. The method as cleiimed in claim 20, wherein the lid substrate is a second 
wafer and the lids are second chips, and each second chip has at least one electrode for 
being cooperated with the moveable structure of the first chip and a plurality of pads 
disposed on one side of the second chip. 



12