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Full text of "USPTO Patents Application 10826261"

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DBs 


Default 
Operator 


Plurals 


Time Stamp 


LI 


80 


"5323051" 


USPAT; 
JPO 


OR 


ON 


2005/05/12 23:18 


L2 


3 


"6415505".pn. or "5925936".pn. 
or "6004867".pn. 


USPAT; 
JPO 


OR 


ON 


2005/05/12 23:20 


L3 


8 


(257/777 or 438/108 or 438/109 
or 361/760) and moveable near 
structures 


USPAT; 
JPO 


OR 


ON 


2005/05/12 23:30 


L4 


1374 


(257/777 or 438/108 or 438/109 
or 361/760) and lead with (ball or 
bump) 


USPAT; 
JPO 


OR 


ON 


2005/05/12 23:31 


L5 


582 


(257/777) and lead with (ball or 
bump) 


USPAT; 
JPO 


OR 


ON 


2005/05/12 23:44 


L7 


0 


"6522015".pn. and wir$3 with 
instead with (ball or bump) 


USPAT 


OR 


OFF 


2005/05/12 23:38 


L8 


0 


"6522015".pn. and wir$3 with 
(instead or substitut$3 or plac$3) 
with (ball or bump) ! 


USPAT 


OR 


OFF 


2005/05/12 23:38 


L9 


13 


(257/777) and wir$3 with (instead 
or substitut$3 or plac$3) with (ball 
or bump) same lead 


USPAT; 
JPO 


OR 


ON 


2005/05/12 23:39 


L10 


32 


mother near chip and lead with 
(ball or bump) 


USPAT; 
JPO 


OR 


ON 


2005/05/12 23:44 


Lll 


0 


"6239366".pn. and bump with 
(gold or "Ag") 


USPAT 


OR 


OFF 


2005/05/13 01:16 


L12 


0 


"6239366". pn. and bump with 
(solder) 


USPAT 


OR 


OFF 


2005/05/13 01:16 


L13 


30 


257/777 and lead same bump with 
(solder) and bump with (gold or 
"Ag") 


USPAT 


OR 


OFF 


2005/05/13 01:19 


L14 


17 


257/777 and lead with flush 


USPAT 


OR 


OFF 


2005/05/13 01:25 


L15 


731 


257/414 


US-PGPUB; 

USPAT; 

USOCR; 

EPO; JPO; 

DERWENT; 

IBM_TDB 


OR 


OFF 


2005/05/13 01:26 


L16 


923 


257/415 


US-PGPUB; 
USPAT; 

EPO; JPO; 

DERWENT; 

IBM_TDB 


OR 


OFF 


2005/05/13 01:40 



Search History 5/13/05 2:10:23 AM Page 1 

C:\Documents and Settings\CChu\My Documents\EASRWorkspaces\10826261.wsp 



L17 


663 


257/419 


US-PGPUB; 

USPAT; 

USOCR; 

EPO; JPO; 

DERWENT; 

IBM_TDB 


OR 


OFF 


2005/05/13 01:52 


L18 


2723 


257/777 


US-PGPUB; 

USPAT; 

USOCR; 

EPO; JPO; 

DERWENT; 

IBM.TDB 


OR 


OFF 


2005/05/13 01:59 


L19 


3232 


257/678 


US-PGPUB; 

USPAT; 

USOCR; 

EPO; JPO; 

DERWENT; 

IBM_TDB 


OR 


OFF 


2005/05/13 01:59 


SI 


1 


"6046506".pn. 


USPAT 


OR 


OFF 


2005/05/11 20:40 


S2 


5 


"6472239" 


USPAT 


OR 


OFF 


2005/05/12 14:08 


S3 


39 


micromachine near 
(semiconductor or die or dice or 
chip or IC) 


USPAT 


OR 


OFF 


2005/05/12 14:09 


S4 


51 


micromachine near 
(semiconductor or die or dice or 
chip or IC) 


USPAT 


OR 


ON 


2005/05/12 14:09 


S5 


61 


micromachine near 
(semiconductor or die or dice or 
chip or IC) 


USPAT; 
JPO 


OR 


ON 


2005/05/12 23:12 



Search History 5/13/05 2:10:23 AM Page 2 

C:\Documents and Settings\CChu\My Documents\EAST\Workspaces\10826261.wsp