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Full text of "USPTO Patents Application 10826261"

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. 08/17/2005 WED 15: 45 



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— — ■ USPTO General Fax 



gjOQ6/02 



Application No,: 10/826,261 Docket No.: 4459-147 

AMENDMENTS TO THE CLAIMS: 

This listing of claims will replace all prior versions, and listings, of claims in the 
application: 

Listing of Claims: 

1. (currently amended) A micromachine package comprising: 
a first chip[[ J]; 

a second chip having a plurality of pads disposed on one side of the second chip; 

at least one moveable structure disposed on [[one of|] the first chip and th e second ohip ; 

at least one electrode for cooperating with the moveable structure and disposed on [[one 
of]] th e first chip and t he seoond chip[[,]]- 

a spacer ring disposed between the first chip and the second chip and surrounding the 
moveable structure; 

a plurality of bumps disposed on the pads; 

a plurality of leads each defining a first lead surface connected to the bump, and an opposite 
second lead surface; and 

an encapsulant encapsulating the first chip, the second chip, the spacer ring, the bumps, and 
the first lead surfaces of the leads, wherein the second lead surfaces of the leads are exposed out of 
the encapsulant. 

2. (original) The micromachine package as claimed in claim 1, further 
comprising: 

a die pad defining a first die-pad surface and an opposite second die-pad surface, wherein 
the first die-pad surface is connected to the first chip and the second die-pad surface is exposed 
out of the encapsulant. 

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Application No,: 10/826,261 Docket No.: 4459-147 

3. (original) The micromachine package as claimed in claim 2, further 
comprising: 

an adhesive for attaching the first chip to the die pad. 

4. (currently amended) The micromachine package as claimed in claim 1, wherein 
the second lead surfaces of the leads are flush with the encapsulan t and the leads are OFN-tvpe 
leads . 

5. (original) The micromachine package as claimed in claim 1, further 
comprising a plurality of solder balls for electrically connecting the first chip to the second chip. 

6. (original) The micromachine package as claimed in claim 1, wherein the 
bump is a gold bump. 

7. (original) The micromachine package as claimed in claim 1, wherein the 
bump is a solder bump. 

8. (withdrawn) A micromachine package comprising: 
a lid; 

a chip having at least on moveable structure and a plurality of pads disposed on one side of 
the chip; 

a spacer ring disposed between the lid and the chip and surrounding the moveable structure; 
a plurality of bumps disposed on the pads; 

a plurality of leads each defining a first lead surface connected to the bump, and an opposite 
second lead surface; and 

an encapsulant encapsulating the lid, the chip, the spacer ring, the bumps, and the first lead 
surfaces of the leads, wherein the second lead surfaces of the leads are exposed out of the 

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Application No»: 10/826,261 Docket No,: 44S9-147 

encapsulant. 

9. (withdrawn) The micromachine package as claimed in claim 8, further 
comprising: 

a die pad defining a first die-pad surface and an opposite second die-pad surface, wherein 
the first die-pad surface is connected to the lid and the second die-pad surface is exposed out of 
the encapsulant. 

10. (withdrawn) The micromachine package as claimed in claim 9, further 
comprising: 

an adhesive for attaching the lid to the die pad. 

11. (withdrawn) The micromachine package as claimed in claim 8, wherein the 
second lead surfaces of the leads are flush with the encapsulant. 

12-13, (cancelled) 

14. (withdrawn) A micromachine package comprising: 
a lid having a plurality of pads disposed on one side of the lid; 
a chip having at least on moveable structure; 

a plurality of solder balls for electrically connecting the chip to the lid; 

a spacer ring disposed between the lid and the chip and surrounding the moveable structure; 

a plurality of bumps disposed on the pads; 

a plurality of leads each defining a first lead surface connected to the bump, and an opposite 
second lead surface; and 

an encapsulant encapsulating the lid, the chip, the spacer ring, the bumps, and the first lead 
surfaces of the leads, wherein the second lead surfaces of the leads are exposed out of the 

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Application No,: 10/826,261 



Docket No.: 4459-147 



encapsulant 

15. (withdrawn) The micromachine package as claimed in claim 14, further 
comprising: 

a die pad defining a first die-pad surface and an opposite second die-pad surface, wherein 
the first die-pad surface is connected to the chip and the second die-pad surface is exposed out of 
the encapsulant. 

16. (withdrawn) The micromachine package as claimed in claim 15, further 
comprising: 

an adhesive for attaching the chip to the die pad. 

17. (withdrawn) The micromachine package as claimed in claim 14, wherein the 
second lead surfaces of the leads are flush with the encapsulant. 

18-19, (cancelled) 

20. (withdrawn) A method for manufacturing a plurality of micromachine packages, 
comprising the following steps of: 

providing a first wafer which comprises a plurality of first chips each having at least one 
moveable structure and a plurality of pads disposed on one side of the first chip, and a plurality 
of scribe lines disposed between the chips; 

forming a plurality of spacer rings individually on the first chips of the first wafer for 
surrounding the moveable structures; 

providing a lid substrate which comprises a plurality of lids, and a plurality of scribe lines 
disposed between the lids; 

attaching the lid substrate on the spacer rings for forming a cavity between the first chip 

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Application No.: 10/826,261 



Docket No.: 4459-147 



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and the lid and receiving the moveable structure; 

cutting the wafer and the lid along the scribe lines of the wafer and the scribe lines of the 
lid substrate for forming a plurality of combined chips; 

forming a plurality of bumps on the pads; 

providing a lead frame stripe which is provided with a plurality of lead frames each 
having a plurality of leads defining first lead surfaces and opposite second lead surfaces; 

disposing the combined chips on the lead frames and connecting the bumps to the first 
lead surfaces of the leads; and 

molding a plurality of encapsulants each encapsulating the first chip, the lid, the spacer 
ring, the bumps, and the first lead surfaces of the leads, wherein the second lead surfaces of the 
leads are exposed out of the encapsulants. 

21. (withdrawn) The method as claimed in claim 20, wherein the lead frame is 
further provided with a die pad defining a first die-pad surface and an opposite second die-pad 
surface, the first die-pad surface is connected to the lid and the second die-pad surface is exposed 
out of the encapsulant 

22, (withdrawn) The method as claimed in claim 21, further comprising the steps 



23- (withdrawn) The method as claimed in claim 20, wherein the lid substrate is a 
second wafer and the lids are second chips, and each second chip has at least one electrode for 
being cooperated with the moveable structure of the first chip and a plurality of pads disposed on 
one side of the second chip. 



of: 



applying an adhesive on the die pad; and 
attaching the lid to the die pad. 



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Application No.: 10/826,261 



Docket No.: 4459-147 



24. (new) The micromachine package as claimed in claim 1, wherein said at least one 
moveable structure comprises a number of moveable structures and said at least one electrode 
comprises the same number of electrodes each corresponding to and disposed above one of said 
moveable structures. 

25. (new) The micromachine package as claimed in claim 1, wherein said second chip, 
as seen in a plan view, has four sides; 

said pads being positioned along at least one, but not all, of said sides of said second chip. 

26. (new) The micromachine package as claimed in claim 25, wherein said pads are 
positioned along only two of said sides of said second chip and said at least one electrode comprises 
multiple electrodes positioned along the other two sides of said second chip. 

27. (new) The micromachine package as claimed in claim 1 , wherein said bumps have 
a thickness greater than a sum of thicknesses of the spacer ring and the first chip. 



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